聚酰亚胺改性覆铜板PI modified copper clad laminates
特点：1) 优异的耐热性；2)高Tg；3) 低介电常数，可提高信号传输速度；4)低介电损耗，减少信号传输过程的能量损失；
应用领域：主要用于大电流、大功率的中央电器供电电路板的制作。具有耐热老化性、耐高低温循环和高玻璃化温度等特性。如汽车中央电器供电系统电路板等的制作。
FEATURES AND BENEFITS：1) Excellent thermal performance; 2)Low dielectric constant,
3) Low dissipation factor; providing improved signal integrity with low signal loss; 4)good machining.
APPLICATIONS：They are suitable for high power and highcircuit through capacity where thermal and highcircuit through is a problem. With excellent mechanical process ability, It is being used in circuit board manufacturing, and in many other high volume commercial, industrial, military and space products including appliance, automotive, TV deflection, audio power, single-board computers, telecommunication, satellite, and more.
主要性能General properties（Testing accord toIPC-4101）
项目
Item |
测试条件
Test condition |
单位
Unit |
指标
Spec. |
典型值typical value |
BT301 |
BT302 |
剥离强度
Peel strength |
A |
N/mm |
1.4 |
1.7 |
1.9 |
绝缘电阻
Insulation resistance
|
C-96/35/90 |
MΩ
|
104 |
106 |
106 |
击穿电压
Dielectric breakdown |
D-48/50+D-0.5/23 |
DC Kv |
40 |
40 |
40 |
介质损耗
Loss tangent |
at 1MHz C-24/23/50 |
|
0.035 |
0.021 |
0.018 |
介电常数
Permittivity |
at 1MHz C-24/23/50 |
|
5.4 |
4.1 |
3.9 |
耐浸焊性
Thermal stress |
288℃ |
秒 S |
60 |
600 |
600 |
玻璃化温度
Tg(DSC) |
A |
℃ |
|
155 |
183 |
燃烧性
Flammability |
A |
|
V-0 |
V-0 |
V-0 |
厚度规格
Thickness＆specification |
1020X1220或500X600X(1.0，1.5，2.0，3.0)mm
可根据用户需要订货 |
铜箔厚度
Copper Thickness |
3,4,6,8，10，12 Oz可根据用户需要订货 |
特性 |
BT301 |
可以在-40-125℃循环使用，不分层不起泡， |
BT302 |
可以在-40-150℃循环使用，不分层不起泡， |
|
